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Lighting Device: White LED

Case 2: LED Wafer Lapping/Polishing Process

In recent years, colorful lights in a variety of wavelengths, ranging from infrared to ultraviolet, have been developed as light emitting diodes (LEDs). Among these, LEDs that emit white light were developed and have been incorporated into various products such as lighting equipment. Here, we’d like to introduce an application process used to lap and polish sapphire wafers for white LEDs.

 

Lapping/Polishing Process and Method

Conditions
Bonding
Grinding
Lapping
Machine model
EBM-250SA
EHG-250NC
EJW-460IFN-DMP
Tool
Ceramic Plate 250
OD200 #270 V
HYPREZ COPPER
Consumables
WAX
EJ81 coolant
6 µm-LEDO
Running time
20 minutes
20 minutes
20 minutes
Thickness
***
110 µm
85 µm
Roughness
***
Ra <0.5 µm
Ra <10 nm

 

Equipment Used for This Process