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Lighting Device: White LED
Case 2: LED Wafer Lapping/Polishing Process
In recent years, colorful lights in a variety of wavelengths, ranging from infrared to ultraviolet, have been developed as light emitting diodes (LEDs). Among these, LEDs that emit white light were developed and have been incorporated into various products such as lighting equipment. Here, we’d like to introduce an application process used to lap and polish sapphire wafers for white LEDs.
Lapping/Polishing Process and Method
Conditions |
Bonding |
Grinding |
Lapping |
Machine model |
EBM-250SA |
EHG-250NC |
EJW-460IFN-DMP |
Tool |
Ceramic Plate 250 |
OD200 #270 V |
HYPREZ COPPER |
Consumables |
WAX |
EJ81 coolant |
6 µm-LEDO |
Running time |
20 minutes |
20 minutes |
20 minutes |
Thickness |
*** |
110 µm |
85 µm |
Roughness |
*** |
Ra <0.5 µm |
Ra <10 nm |
Equipment Used for This Process
