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EJW-400HSP

High Speed & Pressure Lapping Machine

EJW-400HSP

The EJW‐400HSP series High Speed & High Pressure Fine Grinding Machine is the latest in the Trinity‐ α series of
machines. It is designed specifically for the fine grinding of polycrystalline diamond (PCD) compacts. The system is built on an extra sturdy base that ensures vibration free grinding. The main Spindle carrying the custom designed fine grinding wheel is controlled to react to grinding conditions. Each driven work spindle is speed and pressure programmable to adapt to grinding conditions. Thermal monitoring provides valuable in‐process data.

Specifications

Lap Plate Size Maximum Φ380
Lap Plate Speed Variable 30-1000 rpm
Main Spindle Mechanical Bearing
Main Motor 7.5Kw 200V 3Pole
Plate Cooling Chiller Water Jacket
Work Size Maximum 4 inch
Work Pressure Cylinder Φ50*100 mm Stroke
Operation Panel LCD Soft Touch Panel
Elector Control PLC
Program 1 Step
Process Recipe 10 Recipe
Work Drive Motor 120W Independent Drive        Maximum 100 rpm (CCW)
Oscillation 90W Variable Stroke
Utility Power 200V 3Phase 63A  Air CDA 0.5 Mpa
Machine Size W1200 x D1100 x H2835 (mm)
Weight 1400kg