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Lapping Plates

HYPREZ Series (Composite Lapping Plates)

The materials of the Hyprez lapping plate series are all composites of a polymer material and metal powder. They have a certain flexibility and elasticity to allow the uniform holding of diamond powder to be as fixed abrasive particles.

HYPREZ Iron

HYPREZ Iron
Aggressive Stock Removal

・ Used as an alternative to lapping with loose abrasives
・ Provides a primary polish

Recommended slurry:
9 µm / 15 µm / 30 µm

HYPREZ Copper

HYPREZ Copper
Moderate Stock Removal

・ Optimum for moderate stock removal
・ Suitable for virtually any solid material

Recommended slurry:
3 µm / 6 µm / 9 µm

HYPREZ Tin TX－１０

HYPREZ Tin TX－10
Low Stock Removal

・ Suitable for low stock removal
・ Optimum for pre-polish lapping

Recommended slurry:
1/2 µm / 1 µm / 2 µm

HYPREZ Ceramic

HYPREZ Ceramic
Moderate Stock Removal

・ Prevents contamination of a ceramic product
・ Optimum to prevent adhesion of metals

Recommended slurry:
1 µm / 2 µm / 3 µm